ADPA7009-2-EVALZ Power Amplifier Evaluation Board
Analog Devices Inc. ADPA7009-2-EVALZ Power Amplifier Evaluation Board consists of a 2-layer printed circuit board (PCB) fabricated from 10mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader provides thermal relief to the ADPA7009-2 and mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heat sinks for improved thermal management. The 1.85 mm female coaxial connectors populate the RFIN and RFOUT ports, and the respective RF traces are of 50Ω characteristic impedance. The Analog Devices Inc. ADPA7009-2-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA7009.
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