TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

Resultados: 15
Seleccionar Imagen N.° de pieza Fabricante: Descripción Hoja de datos Disponibilidad Precio: (USD) Filtre los resultados en la tabla por precio unitario en función de su cantidad. Cantidad RoHS Producto Tipo Aleación Tipo de paquete
Chip Quik Soldadura Paste No-Clean 500g Sn63/Pb37 T4 7En existencias
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Soldadura Paste No-Clean 15g Sn63/Pb37 T4 244En existencias
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Soldadura Paste No-Clean 35g Sn63/Pb37 T4 418En existencias
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Soldadura Paste No-Clean 250g Sn63/Pb37 T4 160En existencias
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Soldadura Paste No-Clean 50g Sn63/Pb37 T4 194En existencias
458Se espera el 12/08/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Soldadura Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4 349En existencias
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Soldadura Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4 161En existencias
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Soldadura Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4 66En existencias
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Soldadura Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4 82En existencias
196Se espera el 26/08/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Soldadura Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5 121En existencias
262Se espera el 9/09/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Soldadura Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5 96En existencias
241En pedido
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Soldadura Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5 140En existencias
360Se espera el 26/08/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Soldadura Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5 47En existencias
135Se espera el 12/08/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Soldadura Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4 Plazo de entrega no en existencias 6 Semanas
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Soldadura Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5 N/A
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge