Microchip Technology HV-D3 mSiC® Power Modules

Microchip Technology HV-D3 mSiC® Power Modules simplify and accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers and other high-voltage power applications. These high-efficiency power modules integrate 3.3kV silicon carbide (SiC) mSiC MOSFETs and Schottky diodes in an industry-standard 62mm package. This design construction enables efficient power delivery from medium-voltage grids directly to server racks. The HV-D3 modules deliver low switching losses, strong thermal performance, and high power density for demanding applications. Typical applications for Microchip Technology HV-D3 mSiC Power Modules include power transmission and distribution, industrial power, data centers, marine and aerospace, electric vehicle (EV) infrastructure, and renewable energy systems.

Features

  • High-efficiency power conversion
    • Exhibits low switching and conduction losses
    • Improves overall system efficiency
    • Reduces heat generation
    • Enables higher switching frequencies
  • High-voltage and -current capability
    • Supports high-voltage operation of up to 3.3kV
    • Delivers robust current capability for reliable, high-power conversion
  • Compact, integrated module form
    • Multiple switches and diodes in a single package with standardized terminals
    • Simplified assembly
    • More compact and reliable solution compared to discrete device implementations
  • Superior thermal performance
    • Thermal design with silicon nitride (Si3N4) substrate, including low junction-to-case thermal resistance and high junction temperature
    • Supports higher power density
    • Less-aggressive cooling requirements
  • Enhanced switching performance
    • SiC technology supports fast switching transitions with minimal reverse recovery effects
    • Enables smaller, passive components
    • Potentially lowers system weight and cost
  • Robust high-voltage isolation
    • Reliable modules designed for high-voltage applications
    • 6kV insulation, Comparative Tracking Index 600 (CTI 600) case, and robust Si3N4 substrate
    • Offers high dielectric strength and creepage distances
  • Design flexibility
    • Half-bridge and common source configurations
    • Well-suited for 2-level and multi-level converters
  • Improved system reliability
    • Better avalanche ruggedness, thermal stability, and tolerance to voltage stress
    • Longer service life
    • Fewer field failures

Applications

  • Power transmission and distribution
    • Medium-voltage DC-DC converters
    • SSTs
    • High-voltage power supplies
  • Industrial power
    • High-power variable frequency drives (VFDs)
    • Pumps, compressors, and large industrial machinery
  • Data centers
    • SSTs
    • Uninterruptible power supply (UPS) systems
    • Medium-voltage power planes and direct distribution
    • Centralized AC-DC conversion
  • Marine and aerospace
    • Electric propulsion systems for ships and aircraft
    • High-voltage auxiliary power units
  • EV infrastructure
    • Fast DC charging stations
    • High-voltage onboard chargers for commercial vehicles
  • Renewable energy systems
    • Solar, central inverters, and string inverters
    • Wind turbine converters
    • Energy storage systems (ESS) and grid-tied inverters

Application Examples

Chart - Microchip Technology HV-D3 mSiC® Power Modules
Publicado: 2026-05-29 | Actualizado: 2026-06-02