Molex HSAutoLink I Interconnect System
Molex HSAutoLink I Interconnect System is available in four and five circuits and delivers data rates up to 2Gbps. The dependable HSAutoLink Interconnect System brings a proven, USCAR-30-compliant solution for point-to-point in-vehicle connections, complete with multiple keying options and full-length cable shielding for superior signal performance and reduced Electro-Magnetic Interference (EMI)
Features
- Data rates up to 2.0Gbps in 4x and 5x circuit connectors, supports multiple protocols in the same connector (USB 2.0, LVDS, Ethernet, APIX, etc.)
- Fully protected shield case, rear side of the right-angle header includes a closed shield for robustness, signal integrity, and EMI protection
- Headers manufactured from high-temperature plastic material, compatible with lead-free through-hole reflow process (pin-in-paste) or lead-free selective wave soldering process. Meets Jedec +260°C peak temperature
- Full-length cable shielding provides superior signal performance and reduced electromagnetic interference (EMI)
- Compact, low-profile system optimizes device-side space savings to meet future needs for increasing high-speed communication links
- Multiple polarizations and color-coding available, 10x polarizations and colored headers available for either end of the cable assembly. Ensures correct assembly and provides versatility
Applications
- Infotainment
- Telematics
- Navigation systems
- Connected vehicle services
- Diagnostics and data upload
- Camera to controller
- Controller to display
Additional Resources
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Publicado: 2019-08-12
| Actualizado: 2025-05-23