Quectel FC06E Modules
Quectel FC06E Modules are high-performance Wi-Fi® 6 and BLUETOOTH® 5.3 LCC package modules. These modules support 2 x 2 + 2 x 2 MIMO, delivering a maximum data rate of up to 1774.5Mbps. The FC06E modules use Surface-Mount Technology (SMT), an ideal solution for durable, rugged designs. These modules feature advanced packaging, laser-engraved labeling with improved heat dissipation, and indelible markings, supporting large-scale automated manufacturing with strict cost and efficiency requirements. The FC06E modules provide a reliable PCIe 3.0 interface for low-power, high-speed data transmission. These modules offer compact size, low power consumption, wide temperature range, high transmit power, and high reliability, meeting the requirements of industrial and consumer goods applications.
Features
- 2.4GHz and 5GHz Wi-Fi® bands and Bluetooth® 5.3
- Dual Band Simultaneous (DBS)
- PCIe 3.0 interface that supports a higher data transmission rate and enables lower power consumption
- Simple design minimizes design-in time and development efforts, enabling fast time-to-market
- Supports 2 x 2 + 2 x 2 MIMO, delivering a maximum data rate up to 1774.5Mbps
- Low profile and small LCC package size
- Advanced packaging, laser-engraved labeling with improved heat dissipation, and indelible markings
- Surface-Mount Technology (SMT)
Applications
- Industrial
- Consumer goods
Specifications
- IEEE 802.11a/b/g/n/ac/ax WLAN protocol
- DBPSK/DQPSK/CCK/BPSK/QPSK/QAM Wi-Fi modulation mode
- WPA3 encryption mode
- AP/STA Wi-Fi operating mode
- Interfaces:
- 1 x PCle
- 1 x PCM
- 1 x UART
- 2 x Wi-Fi antenna interfaces (ANT_WIFI0, ANT_WIFI1)
- 1 x Bluetooth antenna interface (ANT_BT)
- 1.8V I/O power supply voltage
- -30°C to +75°C operating temperature range
- 25.5mm x 22mm x 2.25mm dimensions
- 2.58g approximate weight