STMicroelectronics A2TBH45M65W3-FC Power Module
STMicroelectronics A2TBH45M65W3-FC Power Module realizes a triple boost plus half-bridge topology in an ACEPACK™ 2 module with NTC and capacitance. It integrates the current advances in silicon carbide MOSFETs from STMicroelectronics, represented by third-generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.
Features
- ACEPACK 2 power module
- 49mΩ typical RDS(on) triple boost switch
- 23.5mΩ typical RDS(on) half-bridge switch
- 2.5kVRMS insulation voltage
- Integrated NTC temperature sensor
- Integrated DC link capacitor
- DBC Cu-Al2O3-Cu based
- Press-fit contact pins
Applications
- DC-DC converters
- Solar inverters
Electrical Topology and Pin Description
Additional Resources
- Technical Note: ACEPACK 1 and 2, SiC Power Modules: How to Read Our Datasheet
- Technical Note: Press-Fit ACEPACK Power Modules Mounting Instructions
- Flyer: ACEPACK Modules with SiC MOSFETs
- Flyer: ACEPACK 1 and 2 Sic MOFETs Based
- Flyer: STPOWER Studio - Dynamic Electro-Thermal Simulator for STPOWER Devices
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Publicado: 2025-03-18
| Actualizado: 2025-04-04