Infineon Technologies G1 EM & LM CoolSET™ System in Packages (SiPs)

Infineon Technologies G1 EM and LM CoolSET™ System in Package (SiP) integrates a high-voltage power switch and control on the primary and secondary sides, SR control, and regulation loop. Due to system forward integration, many discrete system components can be removed.

The timings of the primary side power switch control and secondary side SR control are matched and enable reliable and robust operation under all switching conditions. The coreless transformer technology (CT-Link) used provides reinforced and safe isolated communication between the primary and secondary sides. The advanced PWM switching pattern forces a quasi-resonant ZVS flyback operation, reducing the turn-on switching losses and optimizing the EMI signature. The Infineon G1 EM and LM CoolSET SiP supplies an advanced set of protection features that support ease of design-in.

Features

  • Integrated 800V avalanche rugged CoolMOS P7
  • Fast startup with integrated 950V startup-cell
  • Integrated synchronous rectification (SR) driver with a typical 10V output
  • Integrated reinforced isolated communication from the secondary to the primary side
  • Integrated general-purpose isolated enable signal path from secondary to primary side (G1 EM)
  • Built-in secondary side feedback control loop with error amplifier
  • Novel zero-voltage switching (ZVS) flyback operation for lowest switching losses and low electromagnetic interference (EMI) signature
  • Reliable pulse width modulation (PWM) switching operation by synchronized timing of the primary and secondary side SR switch
  • Optimized low supply currents for hysteretic mode operation to reach stand-by power <50mW
  • Supports primary side wide VCC operating range up to 32V

Applications

  • Auxiliary power supply for home appliances
  • General SMPS

G1 EM Block Diagram

Block Diagram - Infineon Technologies G1 EM & LM CoolSET™ System in Packages (SiPs)

G1 LM Block Diagram

Block Diagram - Infineon Technologies G1 EM & LM CoolSET™ System in Packages (SiPs)
Publicado: 2025-07-16 | Actualizado: 2025-08-14