Nuevos Productos de interfaz térmica
StarTech High-Performance Silicone Thermal Paste is designed for efficient heat transfer and safe application in various environments. This paste is a silicone-based thermal compound with a thermal conductivity of 14.5W/m-K and a wide operating temperature range of -50°C to +280°C, maintaining thermal stability in CPUs, GPUs, and ICs with high TDP under continuous load. StarTech High-Performance Silicone Thermal Paste includes a resealable 10g syringe with screw cap and plunger, enabling controlled, repeatable use in upgrades, repairs, or custom builds. By utilizing electrically non-conductive grease, damaging shorts are prevented, supporting safe use in space-constrained or critical system builds.
-
StarTech High-Performance Silicone Thermal PasteDesigned for efficient heat transfer and safe application in various environments.4/8/2026
-
Bourns BTJ Thermal Jumper ChipsUnique surface-mount components that provide high thermal conductivity for thermal dissipation.2/2/2026 -
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.11/6/2025 -
Laird Technologies Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.9/15/2025 -
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.9/9/2025 -
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap FillersDesigned to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.8/25/2025 -
Wakefield Thermal ulTIMiFlux Dielectric Phase Change TIMThermally conductive electrical insulators for semiconductor-to-heat sink interfaces7/23/2025 -
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.10/25/2024 -
Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.9/10/2024 -
Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.9/10/2024 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.5/30/2024 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.5/27/2024 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.1/18/2024 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.10/30/2023 -
LeaderTech Almohadillas térmicas de fibra de carbono ultrafinas TCFBaja resistencia térmica, superficie blanda y utilizan principalmente fibra de carbono como relleno conductivo térmico.10/18/2023 -
LeaderTech Almohadillas térmicas ultrafinas TGNOfrecen baja resistencia térmica y combinan grafeno y silicona en su fabricación.10/18/2023 -
LeaderTech Lámina de compuestos de indio TCITransiciones de sólido a líquido en su punto de fusión y de vuelta a sólido nuevamente a temperatura ambiente.10/18/2023 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.9/27/2023 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.9/8/2023 -
Bergquist Company Aplicaciones de centros de datosMateriales avanzados que contribuyen a la gestión térmica, la confiabilidad a largo plazo y la protección contra el estrés.4/1/2023 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.8/3/2022 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.8/3/2022 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.7/19/2022 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.7/11/2022 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.6/3/2022