Nuevos DRAM
Micron DRAM 128GB/256GB Commercial Compute Express Links™ (CXLs) are high-speed interconnect, industry-standard interfaces for communications between processors, accelerators, memory, storage, and other IO devices. These devices are flexible memory capacity expansions for data-intensive workloads. The DRAM CXLs memory capacity expansion optimizes cost and performance, intelligently balancing compute and memory resources. The 128GB/256GB CXLs provide the necessary architecture to balance the “memory wall” problem. The architecture helps to achieve economically viable memory solutions through memory expansion, which impacts the DRAM bit growth rate. The DRAM 128GB/256GB CXLs support memory expansion for compute nodes, filling the gap for data-intensive applications that require high bandwidth, capacity, and low latency.
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Micron DRAM 128GB/256GB Compute Express Links™ (CXLs)High-speed interconnect, industry-standard interface for communications between IO devices.11/13/2024
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Kingston Auto Temp eMMCDesigned to meet the extended automotive operating temperature range of -40°C to 105°C.7/24/2024 -
Kingston Auto Temp DDR3L SDRAMDesigned to meet the extended automotive operating temperature range of -40°C to 105°C.7/24/2024 -
Zentel A3F4GH40DBF-WC 4Gb DDR4 SDRAMFeatures 3200Mbps data rate, bi-directional differential data strobe, and Data Mask to write data.7/2/2024 -
Alliance Memory MT46H Automotive LPDDR SDRAMFeatures auto-refresh and self-refresh modes and bidirectional data strobe per byte of data (DQS).2/2/2024 -
Apacer Technology Inc. DDR5-5600 Embedded Memory ModulesEmploys original high-quality DRAM ICs and features memory transfer rates of up to 5600Mbps.1/19/2024 -
Kingston LPDDR4 DRAM DevicesFeature low power consumption and auto precharge option for each burst access.12/1/2023 -
Kingston DDR4 DRAMsDRAMs feature a high-speed option with low power consumption.1/5/2023 -
SMARTsemi DDR4 Memory ICsFeature a power supply (JEDEC standard 1.2V) of VDD = 1.2V ± 5%, and VPP = 2.375V to 2.75V.10/31/2022 -
SMARTsemi DDR3 Memory ICsFeature a double data rate architecture to achieve high-speed operation.10/31/2022 -
AP Memory APSx Double-Data-Rate Octal SPI PSRAMsFeature a 1.62VDD to 1.98VDD single supply voltage range and clock rate up to 200MHz.10/4/2022 -
Winbond W9825G6KB 166MHz High-Speed SDRAMOrganized as 4M words x 4 banks x 16 bits.8/2/2022 -
Winbond W9864G6KT 166MHz High-Speed SDRAMOrganized as 1M words x 4 banks x 16 bits.7/13/2022 -
Winbond W9812G6KB 166/200MHz High-Speed SDRAMOrganized as 2M words x 4 banks x 16 bits.7/13/2022 -
AP Memory Quad SPI (QSPI) PSRAM SDRs in USON8 PackageDelivers IoT RAM ranging from 16M to 64M densities with 2M x8 or 8M x8 organization, up to 72MB/s.4/28/2022 -
AP Memory Octal SPI (OPI & HPI) PSRAM DDRs in BGA24 PackageFeatures 64Mb up to 512M densities with x8 or x16 organization, low pin count, up to 800MB/s.4/28/2022 -
Winbond W66BP6NB/W66CP2NQ SDRAM LPDDR4Offers an SDP or DDP and a 2 or 4 clocks architecture on the Command/Address bus.3/9/2022